We have the most advanced software, hardware and firmware development capability and differentiation competitive advantage, and through the strict test, including temperature humidity degree and impact test, etc., to make sure that all industrial solutions with the most reliable quality.
Enterprise SSD

UBP5MAE

PCIe / AIC
Product Feature
  • Support for NVMe 1.2.
  • Support for dual-mode Boot of UEFI/Legacy.
  • A system boot disk with bootable function.
  • OptionRom support.
  • Ultra-low consistent latency and high-performance ensuring the superior reliability.
  • Data protection of End-to-End Data Path Protection (DPP) can make sure no data error.
  • Power Loss Data Protection in cases of abnormal power failure of SSD.
  • Superior Wear-Leveling for great endurance and reliability of SSD.
  • DWPD 0.3~3 for various workloads of different systems.
  • Support for AES-256, TCG OPAL 2.0 & Enterprise1.0 (Security) data encryption.
Model UBP5MAE
Form Factor AIC (HHHL: 168 x 18.74 x 68.9 mm)
Master Control Marvell 88SS1093
Flash 15nm MLC
Capacity 400GB-1.6TB
Operating Temperature 0~55°C
Non-Operating Temperature -40~85°C
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 2800MB/s
Seq. Write: Up to 1800MB/s
4K Ran. Read: Up to 330000IOPS
4K Ran. Write: Up to 250000IOPS
Working Voltage 12V ± 5%
DWPD (Drive write per day) 0.3-3
TBW
400GB:570TB
800GB:1100TB
960GB:290TB
1.2TB:3800TB
1.6TB:2200TB
Application Data center/server/workstation

UBP6MAE

U.2 / 2.5 inch
Product Feature
  • Support for NVMe 1.2
  • Support for dual-mode Boot of UEFI/Legacy
  • A system boot disk with bootable function
  • OptionRom support
  • Ultra-low consistent latency and high-performance ensuring the superior reliability.
  • Data protection of End-to-End Data Path Protection (DPP) can make sure no data error.
  • Power Loss Data Protection in cases of abnormal power failure of SSD.
  • Superior Wear-Leveling for great endurance and reliability of SSD.
  • DWPD 0.3~3 for various workloads of different systems.
  • Support for AES-256, TCG OPAL 2.0 & Enterprise1.0 (Security) data encryption.
  • Support for Hot-Plug.
Model UBP6MAE
Form Factor 2.5 inch 7.0mm
Master Control Marvell 88SS1093
Flash 15nm MLC
Capacity 480GB-1.6TB
Operating Temperature 0~55°C
Non-Operating Temperature -40~85°C
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 2800MB/s
Seq. Write: Up to 1800MB/s
4K Ran. Read: Up to 330000IOPS
4K Ran. Write: Up to 250000IOPS
Working Voltage 12V ± 5%
DWPD (Drive write per day) 0.3-3
TBW
400GB:570TB
800GB:1100TB
960GB:290TB
1.2TB:3800TB
1.6TB:2200TB
Application Data center/server/workstation

UBPAMAE

M.2 2280/22110
Product Feature
  • Support for NVMe 1.2
  • Support for dual-mode Boot of UEFI/Legacy
  • A system boot disk with bootable function
  • OptionRom support
  • Ultra-low consistent latency and high-performance ensuring the superior reliability.
  • Data protection of End-to-End Data Path Protection (DPP) can make sure no data error.
  • Power Loss Data Protection in cases of abnormal power failure of SSD.
  • Superior Wear-Leveling for great endurance and reliability of SSD.
  • DWPD 0.3~3 for various workloads of different systems.
  • Support for AES-256, TCG OPAL 2.0 & Enterprise1.0 (Security) data encryption.
Model UBPAMAE
Form Factor M.2 2280 / M.2 22110
Master Control Marvell 88SS1093
Flash 15nm MLC
Capacity 120-960GB
Operating Temperature 0~70°C
Non-Operating Temperature -40~85°C
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 2800MB/s
Seq. Write: Up to 1500MB/s
4K Ran. Read: Up to 330000IOPS
4K Ran. Write: Up to 250000IOPS
Working Voltage 3.3V ± 5%
DWPD (Drive write per day) 0.3-3
TBW
120GB:40TB
240GB:80TB
480GB:150TB
960GB:300TB
800GB:1100TB
Application Data center/server/workstation
Indusreial SSD

HG860M UB88MAC

SATA 2.5 inch
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • Various models and specifications designed for the applications in harsh conditions to meet different needs.
  • Mechanism of power loss protection to prevent data loss in the cases of abnormal power failure.
  • Enhanced data recovery mechanism after power-loss to ensure the availability of full data.
  • Use of wear leveling to get equalized overwriting of each blocks in the flash to reduce performance degradation and odds of wear.
  • Negligible WA to avoid too many flash erases to prolong the service life of SSD.
  • Support for Devslp to reduce power consumption of PC in standby mode to extend the standby time.
  • Support for Secure Erase and SMART function
Model HG860M UB88MAC
Form Factor 2.5*7mm (69.85 x 100.18mm x 7mm)
SATA Port SATA III, downward compatible SATA II, SATA I
Master Control SM2246EN Marvell 88NV1120
Flash MLC
Capacity 32~512GB 32~256GB
DRAM DDRIII 128MB-512MB NO
Performance
Seq. Read: Up to 520MB/s
Seq. Write: Up to 450MB/s
4K Ran. Read: Up to 80000IOPS
4K Ran. Write: Up to 70000IOPS
Seq. Read: Up to 252MB/s
Seq. Write: Up to 190MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 41000IOPS
Working Voltage 5V ± 5%
Working Temperature -40~85°C
MTBF 1,200,000 Hours 2,000,000 Hours
TBW
32GB:60TB
64GB:100TB
128GB:200TB
256GB:400TB
512GB:800TB
32GB:48TB
64GB:96TB
128GB:192TB
256GB:384TB
Application Industrial control/military industry/healthcare etc.

UBM2MAC

M.2 2280
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • Standard size of M.2 2280 for different applications, such as Ultrabook. Various models and specifications designed for the applications in harsh conditions to meet different needs.
  • Use of wear leveling to get equalized overwriting of each blocks in the flash to reduce performance degradation and odds of wear.
  • Negligible WA to avoid too many flash erases to prolong the service life of SSD.
  • Support for TRIM command of Windows 7 with optimized write operation & high-performance after the long-term use.
  • Support for Devslp to reduce power consumption of PC in standby mode to extend the standby time.
  • Support for Secure Erase and SMART function.
  • Customized FW.
Model UBM2MAC
Form Factor M.2 2280 (22 x 80 x 3.75mm)
SATA Port SATA III, downward compatible SATA II, SATA I
Master Control Marvell 88NV1120
Flash MLC
Capacity 64~256GB
DRAM NO
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 525MB/s
Seq. Write: Up to 240MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 41000IOPS
Working Voltage 3.3V ± 5%
Working Temperature -40~85°C
TBW
32GB:48TB
64GB:96TB
1280GB:192TB
256TB:384TB
Application Industrial control/military industry/healthcare etc.

UBM3MAC

M.2 2242
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • Standard size of M.2 2280 for different applications, such as Ultrabook. Various models and specifications designed for the applications in harsh conditions to meet different needs.
  • Use of wear leveling to get equalized overwriting of each blocks in the flash to reduce performance degradation and odds of wear.
  • Negligible WA to avoid too many flash erases to prolong the service life of SSD.
  • Support for TRIM command of Windows 7 with optimized write operation & high-performance after the long-term use.
  • Support for Devslp to reduce power consumption of PC in standby mode to extend the standby time.
  • Support for Secure Erase and SMART function.
  • Customized FW.
Model UBM3MAC
Form Factor M.2 2242 (22 x 42 x 3.75mm)
SATA Port SATA III, downward compatible SATA II, SATA I
Master Control Marvell 88NV1120
Flash MLC
Capacity 32~256GB
DRAM NO
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 525MB/s
Seq. Write: Up to 240MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 41000IOPS
Working Voltage 3.3V ± 5%
Working Temperature -40~85°C
TBW
32GB:48TB
64GB:96TB
1280GB:192TB
256TB:384TB
Application Industrial control/military industry/healthcare etc.

UBM4MAC

M.2 2260
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • Standard size of M.2 2280 for different applications, such as Ultrabook. Various models and specifications designed for the applications in harsh conditions to meet different needs.
  • Use of wear leveling to get equalized overwriting of each blocks in the flash to reduce performance degradation and odds of wear.
  • Negligible WA to avoid too many flash erases to prolong the service life of SSD.
  • Support for TRIM command of Windows 7 with optimized write operation & high-performance after the long-term use.
  • Support for Devslp to reduce power consumption of PC in standby mode to extend the standby time.
  • Support for Secure Erase and SMART function.
  • Customized FW.
Model UBM4MAC
Form Factor M.2 2260 (22 x 60 x 3.75mm)
SATA Port SATA III, downward compatible SATA II, SATA I
Master Control Marvell 88NV1120
Flash MLC
Capacity 64~256GB
DRAM NO
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 525MB/s
Seq. Write: Up to 240MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 41000IOPS
Working Voltage 3.3V ± 5%
Working Temperature -40~85°C
TBW
32GB:48TB
64GB:96TB
1280GB:192TB
256TB:384TB
Application Industrial control/military industry/healthcare etc.

UBA2MAC

mSATA
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • MO-300 compliant.
  • Support for SATA II port standard & old version motherboard compatible.
  • Professional design of power circuit specifically for industrial control machines with the stability of SSD greatly increased.
  • Support for Devslp to reduce power consumption of PC in standby mode to extend the standby time.
  • Support for Secure Erase and SMART function.
  • Enhanced data recovery mechanism after power-loss to ensure the availability of full data.
Model mSATA
Form Factor mSATA (50.8 x 29.85 x 3.5mm)
SATA Port SATA III, downward compatible SATA II, SATA I
Master Control Marvell 88NV1120
Flash MLC
Capacity 32~256GB
DRAM NO
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 525MB/s
Seq. Write: Up to 190MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 39000IOPS
Working Voltage 3.3V ± 5%
Working Temperature -40~85°C
TBW
32GB:48TB
64GB:96TB
1280GB:192TB
256TB:384TB
Application Industrial control/military industry/healthcare etc.

UBA1MAC

Half Slim
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • MO-300 compliant.
  • Support for SATA II port standard & old version motherboard compatible.
  • Professional design of power circuit specifically for industrial control machines with the stability of SSD greatly increased.
  • Support for Devslp to reduce power consumption of PC in standby mode to extend the standby time.
  • Support for Secure Erase and SMART function.
  • Enhanced data recovery mechanism after power-loss to ensure the availability of full data.
Model Halfslim (54 x 36.7 x 4 mm)
Form Factor mSATA (50.8 x 29.85 x 3.5mm)
SATA Port SATA III, downward compatible SATA II, SATA I
Master Control Marvell 88NV1120
Flash MLC
Capacity 32~256GB
DRAM NO
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 525MB/s
Seq. Write: Up to 190MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 39000IOPS
Working Voltage 3.3V ± 5%
Working Temperature -40~85°C
TBW
32GB:48TB
64GB:96TB
1280GB:192TB
256TB:384TB
Application Industrial control/military industry/healthcare etc.

UB96MAC

SATA DOM
Product Feature
  • Use of wipe temperature particles, controller and other components to work at the temperature from -40°C to 85°C.
  • Customized design to meet customers’ needs.
  • Use of wear leveling to get equalized overwriting of each blocks in the flash to reduce performance degradation and odds of wear.
  • Support for TRIM command of Windows with optimized write operation.
  • Power Loss Data Protection to protect clients’ data.
  • Support for Secure Erase and SMART function.
Model UB96MAC
Form Factor SATA DOM
Master Control Marvell 88NV1120
Flash MLC PSLC
DRAM NO
MTBF 2,000,000 Hours
Performance
Seq. Read: Up to 520MB/s
Seq. Write: Up to 190MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 41000IOPS
Seq. Read: Up to 500MB/s
Seq. Write: Up to 390MB/s
4K Ran. Read: Up to 32000IOPS
4K Ran. Write: Up to 42000IOPS
Working Voltage 5V ± 5%
Working Temperature -40~85°C
TBW
32GB:48TB
64GB:96TB
1280GB:192TB
256TB:384TB
Application Industrial control/military industry/healthcare etc.
Industrial Memory

ECC Memory

Product Feature
  • Standard JEDEC design specifications.
  • ECC parity error-correction.
  • Special VLP of 18.7mm.
  • Adoption of industrial high-quality DEAM.
  • Strict process control over PCB & material verification.
  • Power Loss Data Protection to protect clients’ data.
  • Support for Secure Erase and SMART function.
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 ECC UDIMM PC4-19200 4GB-16GB 1.2V * * CL17 288-pin 30μ"
DDR4-2133 ECC UDIMM PC4-17000 4GB-16GB 1.2V * * * CL15 288-pin 30μ"
DDR3-1600 ECC UDIMM PC3-12800 2GB-8GB 1.5V * * * CL11 240-pin 30μ"
DDR4-1333 ECC UDIMM PC3-10600 1GB-8GB 1.5V * * * CL9 240-pin 30μ"
▲ default * optional

ECC Memory VLP

Product Feature
  • Standard JEDEC design specifications.
  • ECC parity error-correction.
  • Special VLP of 18.7mm.
  • Adoption of industrial high-quality DEAM.
  • Strict process control over PCB & material verification.
  • Power Loss Data Protection to protect clients’ data.
  • Support for Secure Erase and SMART function.
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 ECC VLP PC4-19200 4GB-16GB 1.2V * * * CL17 288-pin 30μ"
DDR4-2133 ECC UDIMM PC4-17000 4GB-16GB 1.2V * * * CL15 288-pin 30μ"
DDR3-1600 ECC UDIMM PC3-12800 2GB-8GB 1.5V/1.35V * * * CL11 240-pin 30μ"
DDR3-1333 ECC UDIMM PC3-10600 1GB-8GB 1.5V/1.35V * * * CL9 240-pin 30μ"
▲ default * optional

Mini ECC Memory

Product Feature
  • Standard JEDEC design specifications.
  • Professional design of embedded industrial control.
  • ECC parity error-correction.
  • Special VLP of 18.7mm.
  • Adoption of industrial DEAM.
  • Strict process control over PCB & material verification
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR3-1600 ECC UDIMM PC3-12800 2GB-8GB 1.35V * * * CL11 240-pin 30μ"
DDR3-1333 ECC UDIMM PC3-10600 1GB-8GB 1.35V * * * CL9 240-pin 30μ"
▲ default * optional

Mini ECC Memory VLP

Product Feature
  • Standard JEDEC design specifications.
  • Professional design of embedded industrial control.
  • ECC parity error-correction.
  • Special VLP of 18.7mm.
  • Adoption of industrial DEAM.
  • Strict process control over PCB & material verification
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR3-1600 ECC UDIMM PC3-12800 1GB-4GB 1.35V * * * CL11 240-pin 30μ"
DDR3-1333 ECC UDIMM PC3-10600 1GB-4GB 1.35V * * * CL9 240-pin 30μ"
▲ default * optional

REG Memory

Product Feature
  • Standard JEDEC design specifications.
  • ECC parity error-correction.
  • REG function to maintain the synchronization and driving force consistency of data signal under high-speed multi-loads.
  • Special VLP of 18.7mm.
  • Standard height design of 30~31mm.
  • Adoption of industrial DEAM.
  • Strict process control over PCB & material verification
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 REG PC4-19200 4GB-32GB 1.2V * CL17 288-pin 30μ"
DDR4-2133 REG PC4-17000 4GB-32GB 1.2V * CL15 288-pin 30μ"
DDR3-1866 REG PC3-14900 4GB-16GB 1.35V * CL13 240-pin 30μ"
DDR3-1600 REG PC3-12800 4GB-16GB 1.35V * CL11 240-pin 30μ"
▲ default * optional

REG Memory VLP

Product Feature
  • Standard JEDEC design specifications.
  • ECC parity error-correction.
  • REG function to maintain the synchronization and driving force consistency of data signal under high-speed multi-loads.
  • Special VLP of 18.7mm.
  • Standard height design of 30~31mm.
  • Adoption of industrial DEAM.
  • Strict process control over PCB & material verification
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 REG VLP PC4-19200 4GB-16GB 1.2V * CL17 288-pin 30μ"
DDR4-2133 REG VLP PC4-17000 4GB-16GB 1.2V * CL15 288-pin 30μ"
DDR3-1600 REG VLP PC3-12800 2GB-8GB 1.35V * CL13 240-pin 30μ"
DDR3-1333 REG VLP PC3-10600 1GB-8GB 1.35V * CL9 240-pin 30μ"
▲ default * optional

Industrial Laptop/Notebook Memory

Product Feature
  • Standard JEDEC design specifications.
  • Adoption of industrial DEAM.
  • Strict process control over PCB & material verification.
  • Low Power mode.
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 SODIMM PC4-19200 4GB-16GB 1.2V * * CL17 260-pin 30μ"
DDR4-2133 SODIMM PC4-17000 4GB-16GB 1.2V * * * CL15 260-pin 30μ"
DDR3-1600 SODIMM PC3-12800 4GB-16GB 1.5/1.35V * * * CL11 240-pin 5μ"-30μ"
DDR3-1333 SODIMM PC3-10600 4GB-16GB 1.5/1.35V * * * CL9 240-pin 5μ"-30μ"
▲ default * optional

Laptop/Notebook ECC Memory

Product Feature
  • Standard JEDEC design specifications.
  • ECC parity error-correction.
  • Strict process control over PCB & material verification.
  • Adoption of Server-grade DEAM.
  • Embedded industrial control solution.
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 ECC SODIMM PC4-19200 4GB-16GB 1.2V * * CL17 260-pin 30μ"
DDR4-2133 ECC SODIMM PC4-17000 4GB-16GB 1.2V * * CL15 260-pin 30μ"
DDR3-1600 ECC SODIMM PC3-12800 2GB-8GB 1.5v/1.35V * * * CL11 240-pin 30μ"
DDR3-1333 ECC SODIMM PC3-10600 1GB-8GB 1.5v/1.35V * * * CL9 240-pin 30μ"
▲ default * optional

Industrial Desktop Computer Memory

Product Feature
  • Standard JEDEC design specifications.
  • Standard height design of 30~31mm.
  • Special VLP of 18.7mm.
  • Adoption of industrial DEAM.
  • Strict process control over PCB & material verification.
Spec. Bandwidth Capacity Voltage Working Temperature CL Latency Pin Golden Finger
Low-Temp High-Temp
-40°C -20°C 0°C 85°C 95°C
DDR4-2400 UDIMM PC4-19200 4GB-16GB 1.2V * * CL17 288-pin 30μ"
DDR4-2133 UDIMM PC4-17000 4GB-16GB 1.2V * * * CL15 288-pin 30μ"
DDR3-1600 UDIMM PC3-12800 2GB-8GB 1.5 * * * CL11 240-pin 5μ"-30μ"
DDR3-1333 UDIMM PC3-10600 1GB-8GB 1.5 * * * CL9 240-pin 5μ"-30μ"
▲ default * optional
Others

Compact Flash

Product Feature
  • PCMCIA & ATA compliant.
  • Solutions at different levels for clients.
  • Application in the mobile and industrial devices.
Form Factor 42.8 x 36.4 x 3.3mm
Port Compact Flash, 50P
Flash MLC
Capacity 4~64GB
Performance
Seq. Read: Up to 90MB/s
Seq. Write: Up to 60MB/s
Working Temperature -40~85°C
Application IPC/camera

SD Flash Card

Product Feature
  • SD2.0 standard compatible & fool-proof port design.
  • Various SD card models to meet needs of different clients.
  • Comprehensive test and validation.
  • Write protected to avoid data damage.
Form Factor 24 x 32 x 1.4mm
Port SD Flash Card
Flash MLC/SLC
Capacity 4~128GB
Performance
Seq. Read: Up to 140MB/s
Seq. Write: Up to 40MB/s
Working Temperature -40~85°C
Application IPC/camera

Standard Micro SD

Product Feature
  • SD2.0 standard compatible.
  • Small size & easy to carry and deliver.
  • Customized design to meet needs of different clients.
  • Support for SMART function to monitor the reliability of Micro SD products.
Controller SMI
Form Factor 24 x 32 x 1.4mm
Port SD2.0/SD3.0
Flash MLC/SLC
Capacity 512MB~128GB
Performance
Seq. Read: Up to 140MB/s
Seq. Write: Up to 40MB/s
Working Temperature -40~85°C
Application Mobile phone/camera/industry

EMMC

Product Feature
  • DAM(Data Acceleration Mode)
  • DSWL(Dynamic/Static Wear Leveling algorithm)
  • PRDR(Proactive Read-Disturb Replacement)
  • SECC(Strong Error Correction Code)
  • BBM(Bad Block Life-Cycle Management)
  • PLP(Power-loss Protection)
Product Model KM110SS2008GxA-DDD00WT KM110SH0016GxA-DDD00WT KM110SS0016GxA-DDD00WT KM110SS1032GxA-DDD00WT
Density 8GB 16GB 32GB
eMMC Specification eMMC 5.1
NAND Feature 2D TLC 3D TLC
Package FBGA153
Dimensions 11.5*11*1.0mm
Operating Temperature -25℃~85℃
Storage temperature -40℃~85℃
Contact Information
Kimtigo Headquarters
Block B, Changfang Lighting Industrial Park, Julongshan 3rd Rd, Big Industrial Zone, Pingshan Town, Shenzhen, 518000, Guangdong,China​
Tel: ​+86-400-8385-689
Mail: kimtigo@newlystar.com